US Patent Issued to Enkris Semiconductor (Wuxi) on Sept. 22 for "Composite substrate, manufacturing method thereof and semiconductor device" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,456, issued on Sept. 22, was assigned to Enkris Semiconductor (Wuxi) Ltd. (Wuxi, China).

"Composite substrate, manufacturing method thereof and semiconductor device" was invented by Kai Cheng (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite substrate includes a supporting substrate layer, a buried layer and a growth substrate layer stacked in sequence. The buried layer is provided with a plurality of grooves at least partially penetrating the buried layer, the supporting substrate layer includes a charge trapping region beneath the plurality of grooves, and on a plane where the supporting substrate layer is located, shapes of...