US Patent Issued to Enjet on July 14 for "Method of forming a 3D conformal conductive pattern" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,154, issued on July 14, was assigned to Enjet Co. Ltd. (Suon-Si, South Korea).

"Method of forming a 3D conformal conductive pattern" was invented by Do Young Byun (Gyeonggi-do, South Korea), Won-il Son (Gyeonggi-do, South Korea) and Jang Seung Jun (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a method of forming a conductive pattern by printing a conductive ink on a substrate having a three-dimensional surface. The method includes a substrate providing step of mounting the substrate; an ink injection step of printing a conformal conductive pattern on the three-dimensional surface of the su...