US Patent Issued to EnerProx on June 30 for "Heat pump enclosure" (Canadian Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. D1,132,463, issued on June 30, was assigned to EnerProx Inc. (Victoriaville, Canada).

"Heat pump enclosure" was invented by Christian Poudrier (Victoriaville, Canada).

The patent was filed on Jan. 20, 2022, under Application No. D/823,885.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1132463&OS=D1132463&RS=D1132463

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