US Patent Issued to EM Microelectronic-Marin on July 21 for "Semiconductor wafer" (Swiss Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,460, issued on July 21, was assigned to EM Microelectronic-Marin SA (Marin, Switzerland).

"Semiconductor wafer" was invented by Christophe Entringer (Corcelles-pres-Concise, Switzerland), Yves Dupraz (Valeyres sous Montagny, Switzerland), Pierre Muller (Marin-Epagnier, Switzerland), Zeng Wang (Bienne, Switzerland), Alexis Durand (Cudrefin, Switzerland) and Arthur Hugh MacDougall (Cornaux, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer (1a, 1b) including a plurality of chips (2) and a separation zone (3) spacing the semiconductor chips (2) from each other in this wafer (1a, 1b), such a separation zone (3) extending f...