US Patent Issued to Eliyan on Sept. 22 for "Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs)" (California Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,658, issued on Sept. 22, was assigned to Eliyan Corp. (Santa Clara, Calif.).

"Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs)" was invented by Ramin Farjadrad (Los Altos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a first integrated circuit (IC) chip device including a first substrate having traces that are of a first connection density and a first chiplet formed via a first IC manufacturing process and coupled to the primary substrate traces. The...