US Patent Issued to Eliyan on June 23 for "Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,022, issued on June 23, was assigned to Eliyan Corp. (Santa Clara, Calif.).

"Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates" was invented by Ramin Farjadrad (Los Altos, Calif.) and Syrus Ziai (Los Altos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-chip module (MCM) includes a common substrate and first and second integrated circuit (IC) chips disposed on the common substrate. The first integrated circuit (IC) chip includes a first interface circuit disposed proximate a first edge of the first IC chip and a second interface circuit disposed proximate the f...