US Patent Issued to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE on Sept. 1 for "Molding thickness inspection system with identified moveable illuminance sensors" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,868, issued on Sept. 1, was assigned to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (Daejeon, South Korea).

"Molding thickness inspection system with identified moveable illuminance sensors" was invented by Yong Kwi Lee (Daejeon, South Korea), Hyun Chul Kang (Daejeon, South Korea), Ji Yeon Son (Daejeon, South Korea), Young Seog Yoon (Daejeon, South Korea) and Chang-Beom Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a molding thickness inspection device, a molding thickness inspection system including the same, and a molding thickness inspection method. The molding thickness inspec...