US Patent Issued to EKC Technology on Sept. 29 for "Conductive composites, inks and adhesives with low silver nanowire loading and low resistivity, and methods for forming conductive features" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,364, issued on Sept. 29, was assigned to EKC Technology Inc. (Hayward, Calif.).

"Conductive composites, inks and adhesives with low silver nanowire loading and low resistivity, and methods for forming conductive features" was invented by Ajay Virkar (San Mateo, Calif.), Amir Tork (Hayward, Calif.), Nazim Uddin (Hayward, Calif.), Ying-Syi Li (Fremont, Calif.) and Xiqiang Yang (Hayward, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Composite materials with good electrical conductivity at low metal loadings are prepared using flowable, curable ink compositions that include polymer matrix precursor, silver nanowires, and reducible metal ions su...