US Patent Issued to EKC TECHNOLOGY on March 3 for "Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures" (California Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,783, issued on March 3, was assigned to EKC TECHNOLOGY INC. (Hayward, Calif.).

"Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures" was invented by Xiqiang Yang (Hayward, Calif.), Yadong Cao (San Jose, Calif.) and Ajay Virkar (San Mateo, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Fe+3 ions, wherein the structure comprises the metal layer comprising copper, nic...