US Patent Issued to EDGELESS SEMICONDUCTOR Co. LTD. OF ZHUHAI, GREE ELECTRIC APPLIANCES INC. OF ZHUHAI on Feb. 17 for "Intelligent power module and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,713, issued on Feb. 17, was assigned to EDGELESS SEMICONDUCTOR Co. LTD. OF ZHUHAI (Zhuhai, China) and GREE ELECTRIC APPLIANCES INC. OF ZHUHAI (Zhuhai, China).

"Intelligent power module and manufacturing method thereof" was invented by Wei Jiang (Zhuhai, China), Bo Shi (Zhuhai, China), Dan Zeng (Zhuhai, China), Jun Cao (Zhuhai, China), Yongbo Liao (Zhuhai, China) and Ting Xiao (Zhuhai, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are an intelligent power module and a manufacturing method thereof, which relate to the technical field of electronic devices. The intelligent power module includes a substrate, wherein a chip and a plurali...