US Patent Issued to ECOPIA TECH on July 14 for "Enhancing elevation models with landcover feature data" (Canadian, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,682,566, issued on July 14, was assigned to ECOPIA TECH Corp. (Toronto).

"Enhancing elevation models with landcover feature data" was invented by Yuanming Shu (Toronto), Shuo Tan (Campbell, Calif.), Dawei Zai (Toronto), Ruijie Deng (Toronto), Zihao Chen (Toronto) and Andi Dai (Toronto).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for enhancing elevation models with landcover feature data are provided. An example method involves accessing imagery covering an area of interest that contains an above-ground feature, generating, a digital surface model of the area of interest, extracting three-dimensional landcover feature data represent...