US Patent Issued to EBARA on Sept. 8 for "Polishing apparatus and polishing method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,495, issued on Sept. 8, was assigned to EBARA Corp. (Tokyo).

"Polishing apparatus and polishing method" was invented by Satoru Yamamoto (Tokyo), Keisuke Uchiyama (Tokyo), Mao Izawa (Tokyo) and Makoto Kashiwagi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a polishing apparatus and a polishing method for polishing a flat portion of a substrate, such as a wafer. The polishing apparatus (100) includes: a substrate holder configured to hold a substrate (W) and rotate the substrate W; a polishing-tape feeding mechanism (141) configured to advance a polishing tape (3) in its longitudinal direction; and at least one...