ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,662, issued on Oct. 20, was assigned to EBARA Corp. (Tokyo).

"Polishing apparatus with microwave detection sensor" was invented by Seungho Yun (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus capable of measuring a surface temperature of a substrate while suppressing shielding by a polishing liquid is disclosed. The polishing apparatus includes a microwave detection sensor configured to generate microwave detection data by detecting microwaves, and a controller configured to determine the surface temperature of the substrate based on the microwave detection data."

The patent was filed on July 25, 2023, under Application N...