ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,698, issued on March 17, was assigned to EBARA Corp. (Tokyo).
"Plating apparatus" was invented by Masaki Tomita (Tokyo) and Ryosuke Hiwatashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An occurrence of a varied power feeding to a contact member is suppressed.A substrate holder includes: a frame-shaped supporting mechanism configured to be suspended and held by a plurality of support pillars and to support an outer peripheral portion of a surface to be plated of a substrate; a back plate assembly configured to be arranged on a back surface side of the surface to be plated of the substrate and to sandwich the substrate with the supporting ...