US Patent Issued to EBARA on June 2 for "Plating apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,198, issued on June 2, was assigned to EBARA Corp. (Tokyo).

"Plating apparatus" was invented by Shinji Omata (Tokyo), Masaki Tomita (Tokyo), Kentaro Yamamoto (Tokyo) and Yasuyuki Masuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a technique that ensures suppressing deterioration of plating quality of a substrate due to gas bubbles at an anode.A plating module 400 includes a plating tank 10 configured to house a plating solution, an anode 13 arranged in the plating tank 10, a substrate holder 20 configured to hold a substrate WF with a surface to be plated facing downward so as to be opposed to the anode 13, a membrane module 40...