US Patent Issued to EBARA on July 14 for "Plating apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,187, issued on July 14, was assigned to EBARA Corp. (Tokyo).

"Plating apparatus" was invented by Tsubasa Ishii (Tokyo), Masashi Shimoyama (Tokyo), Masashi Obuchi (Tokyo) and Koichi Masuya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, and an anode disposed in the plating tank to oppose the substrate held by the substrate holder. The plating apparatus also includes a conduit having a first portion including an opening end disposed in a region between t...