US Patent Issued to EBARA on April 21 for "Plating apparatus and substrate cleaning method" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,929, issued on April 21, was assigned to EBARA Corp. (Tokyo).

"Plating apparatus and substrate cleaning method" was invented by Kazuhito Tsuji (Tokyo) and Kentaro Yamamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate is efficiently cleaned.A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cle...