US Patent Issued to EBARA, Kyushu Institute of Technology on Aug. 11 for "Polishing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,061, issued on Aug. 11, was assigned to EBARA Corp. (Tokyo) and Kyushu Institute of Technology (Fukuoka, Japan).

"Polishing apparatus" was invented by Hisanori Matsuo (Tokyo) and Keisuke Suzuki (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a polishing apparatus and a polishing method for polishing a workpiece, such as a wafer on which a pattern is formed, on a polishing pad, and more particularly, relates to a polishing apparatus and a polishing method for detecting a geometric element of a pattern, such as a pitch. The polishing apparatus includes: a polishing table (3) configured to support a polis...