US Patent Issued to E Ink on April 21 for "Method of manufacture of a multi-layer device comprising a repair layer having conductive hydrogel film or beads" (Massachusetts Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,896, issued on April 21, was assigned to E Ink Corp. (Billerica, Mass.).

"Method of manufacture of a multi-layer device comprising a repair layer having conductive hydrogel film or beads" was invented by Nishit Murari (Billerica, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layer device and its method of manufacture are disclosed. The multi-layer device comprises a first electrode layer, a first repair layer, a functional layer, and a second electrode layer. The first repair layer comprises a conductive hydrogel film or conductive hydrogel beads, the conductive hydrogel film or the conductive hydrogel beads comprising conductive fil...