US Patent Issued to Duroptix Materials on June 16 for "Curable hotmelt silicone composition, encapsulant, hotmelt adhesives, and optical semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,336, issued on June 16, was assigned to Duroptix Materials K.K. (Tokyo).

"Curable hotmelt silicone composition, encapsulant, hotmelt adhesives, and optical semiconductor device" was invented by Shunya Takeuchi (Chiba, Japan) and Yuri Iguchi (Tochigi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A curable hot-melt silicone composition, comprising, (A) a resinous alkenyl group-containing organopolysiloxane that includes at least two alkenyl groups and at least one aryl group per molecule, (B) a curable linear organopolysiloxane that includes at least one aryl group per molecule, (C) a curable linear or branched organopolysiloxane that includes...