US Patent Issued to DUPONT SAFETY & CONSTRUCTION on June 23 for "Circuit board unwoven fabric, circuit board prepreg using same and circuit board using same" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,775, issued on June 23, was assigned to DUPONT SAFETY & CONSTRUCTION INC. (Wilmington, Del.).

"Circuit board unwoven fabric, circuit board prepreg using same and circuit board using same" was invented by Yuhei Nishimori (Kochi, Japan) and Masahiko Ueta (Kochi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board nonwoven fabric comprising a paper-formed structure which comprises a plurality of thick fibers in which the portion of greatest fiber diameter is 5 micro metre or greater, and a plurality of fine fibers in which the portion of greatest fiber diameter is less than 5 micro metre, wherein an average fiber length of the thick fi...