US Patent Issued to DUPONT ELECTRONICS on March 3 for "Flexible copper-clad laminate and printed circuit made therefrom" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,577, issued on March 3, was assigned to DUPONT ELECTRONICS INC.

"Flexible copper-clad laminate and printed circuit made therefrom" was invented by Shih-Ching Lin (Hsinchu, Taiwan) and Tung Lin Li (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications."

The patent was filed on April 18, ...