ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,050, issued on Feb. 24, was assigned to DUPONT ELECTRONICS INC..
"Thermal substrates" was invented by Christopher Robert Becks (Grove City, Ohio), Rosa Irene Gonzalez (Circleville, Ohio), Thomas D Lantzer (Wake Forest, N.C.) and Rajesh Tripathi (Wilmington, Del.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and...