US Patent Issued to DUPONT ELECTRONICS on Aug. 25 for "Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,144, issued on Aug. 25, was assigned to DUPONT ELECTRONICS INC. (Wilmington, Del.).

"Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom" was invented by Shih-Ching Lin (Hsinchu, Taiwan) and Ya-Mei Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses an ultrathin copper foil without a carrier, that has an area weight of about 45 g/m2 or less; a nominal thickness of about 5.0 micro metre or less; a tensile strength of about 40 Kgf/mm2 or more; and a loop stiffness of 2 mN or more. Also disclosed are methods for manufacturing the present ultrathin copper foils, surfac...