US Patent Issued to DUPONT ELECTRONIC MATERIALS INTERNATIONAL on Aug. 11 for "Resist underlayer compositions and pattern formation methods using such compositions" (Massachusetts Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,704,778, issued on Aug. 11, was assigned to DUPONT ELECTRONIC MATERIALS INTERNATIONAL LLC (Marlborough, Mass.).

"Resist underlayer compositions and pattern formation methods using such compositions" was invented by Li Cui (Westborough, Mass.), Shintaro Yamada (Shrewsbury, Mass.), Iou-Sheng Ke (Andover, Mass.), Paul J. LaBeaume (Auburn, Mass.), Suzanne M. Coley (Mansfield, Mass.), James F. Cameron (Brookline, Mass.), Keren Zhang (Shrewsbury, Mass.) and Joshua Kaitz (Watertown, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resist underlayer composition including a polymer having a polymer backbone and a substituted or unsubstituted fullerene grou...