ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,998, issued on July 14, was assigned to DuPont Electronic Materials Holding Inc. (Newark, Del.).
"Soluble metal oxide anion CMP slurry" was invented by Yi Guo (Newark, Del.) and Arthur W. Martin (Hockessin, Del.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a chemical mechanical polishing solution for metal and metal nitride substrates comprising: a solvent; at least one abrasive with a Mohs hardness of at least 8; and at least one soluble metal oxide anion wherein the metal is selected from vanadium, niobium, tantalum, chromium, molybdenum and tungsten."
The patent was filed on Jan. 10, 2024, under Application No. 18/409,65...