US Patent Issued to DOWA Electronics Materials on Oct. 20 for "Silver powder and method of producing silver powder" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,597, issued on Oct. 20, was assigned to DOWA Electronics Materials Co. Ltd. (Tokyo).

"Silver powder and method of producing silver powder" was invented by Satoko Sugawara (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a silver powder that is suitable as a conductive filler for a conductive paste that enables low-temperature firing and a method of producing this silver powder. The method of producing a silver powder includes an azole addition step of adding an azole to a silver ammine complex aqueous solution to obtain a first liquid, a reductant addition step of adding a reductant to the first liquid to obtain a second liqu...