US Patent Issued to DOW TORAY on Sept. 8 for "Curing-reactive organopolysiloxane resin, pressure-sensitive adhesive composition using same, and use thereof" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,329, issued on Sept. 8, was assigned to DOW TORAY Co. LTD. (Tokyo).

"Curing-reactive organopolysiloxane resin, pressure-sensitive adhesive composition using same, and use thereof" was invented by Maki Itoh (Ichihara, Japan), Hidefumi Tanaka (Ichihara, Japan), Akihiro Nakamura (Ichihara, Japan), Masahiro Saito (Ichihara, Japan) and Michitaka Suto (Ichihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A curing-reactive organopolysiloxane composition is provided. The composition generally forms a pressure-sensitive adhesive layer which is curable by a hydrosilylation reaction, has excellent adhesiveness and handleability, and is capable of mai...