US Patent Issued to DOW TORAY on Aug. 25 for "Integrated dicing die bonding sheet and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,105, issued on Aug. 25, was assigned to DOW TORAY Co. LTD. (Tokyo).

"Integrated dicing die bonding sheet and method for producing semiconductor device" was invented by Nohno Toda (Ichihara, Japan), Eiji Kitaura (Ichihara, Japan) and Manabu Sutoh (Ichihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an integrated dicing die bonding sheet having excellent storage stability and stress relaxation properties, having no problems such as chip flying, chipping, cracking, and the like during a dicing process, and having excellent production efficiency; and a method of manufacturing a semiconductor device (particularly including a MEMS d...