US Patent Issued to Dow Silicones on July 28 for "Aluminum nitride filled thermally conductive silicone composition" (Chinese, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,426, issued on July 28, was assigned to Dow Silicones Corp. (Midland, Mich.).

"Aluminum nitride filled thermally conductive silicone composition" was invented by Yan Zheng (Shanghai), Dorab Bhagwagar (Saginaw, Mich.), Darren Hansen (Auburn, Mich.), Peng Wei (Shanghai) and Han Guang Wu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition contains: (a) curable silicone composition including: (i) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane with a viscosity of 30 to 400 mPa*s; (ii) a SiH functional crosslinker; and (iii) a hydrosilylation catalyst; where the molar ratio of crosslinker SiH functionality to vinyl functional...