ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,909, issued on June 16, was assigned to Dow Global Technologies LLC (Midland, Mich.).
"Heat resistant thermal seal film" was invented by Shijun Wang (Shanghai), Jichang Feng (Shanghai), Jianping Pan (Shanghai), Xiaobing Yun (Shanghai), Zhe Du (Shanghai), Andong Liu (Shanghai), Lin Liu (Shanghai) and Hong Yang (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "Multilayer films are disclosed. The multilayer film may include a core layer and a heat seal layer where the heat seal lay comprises a polypropylene copolymer and a polyethylene copolymer. The polypropylene copolymer of the heat seal layer has specific properties such as ethylene content ...