US Patent Issued to DOOSAN on July 14 for "Underfill film for semiconductor package and method for manufacturing semiconductor package using same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,002, issued on July 14, was assigned to DOOSAN Corp. (Seoul, South Korea).

"Underfill film for semiconductor package and method for manufacturing semiconductor package using same" was invented by Taejin Choi (Yongin-si, South Korea) and Sooin Park (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing...