ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,976, issued on Feb. 17, was assigned to DONGWOO FINE-CHEM Co. LTD. (Iksan-si, South Korea).
"Adhesive composition and adhesive sheet using the same" was invented by Kyoungmoon Jung (Jeollanam-do, South Korea), Hyerim Kwon (Incheon, South Korea) and Inoh Hwang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition contains a urethane oligomer, a diluent monomer and a photoinitiator, in which a weight ratio of heteroatoms in the diluent monomer is adjusted, and a dielectric constant and a dielectric tangent at 15 GHz of an adhesive layer having a thickness of 150 micro metre after curing are controlled to be w...