US Patent Issued to DISCO on Sept. 1 for "Wafer processing method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,419, issued on Sept. 1, was assigned to DISCO Corp. (Tokyo).

"Wafer processing method" was invented by Kazuma Sekiya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method for dividing a wafer at a peeling layer after forming the peeling layer within the wafer includes a peeling layer forming step of forming a first peeling layer along the side surface of a circular truncated cone and a second peeling layer along the upper surface of the circular truncated cone, a dividing step of dividing the wafer so as to form a thinned wafer that has a first peeling surface exposed by being divided at the first peeling layer and has a se...