US Patent Issued to DISCO on Nov. 3 for "Method of handling wafer" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,681, issued on Nov. 3, was assigned to DISCO Corp. (Tokyo).

"Method of handling wafer" was invented by Masaru Nakamura (Tokyo) and Kohei Tsujimoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of handling a wafer includes a frame unit forming step of forming a frame unit by placing the wafer in a central opening of an annular frame, affixing a dicing tape to a surface of the annular frame, and affixing the wafer to the dicing tape, a dividing step of processing the wafer along projected dicing lines thereon to divide the wafer into individual device chips including respective devices, a package unit forming step of forming a package ...