ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,889, issued on March 17, was assigned to DISCO Corp. (Tokyo).
"Dividing method of wafer" was invented by Keiichiro Niitsu (Tokyo) and Youngsuk Kim (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a dividing method of a wafer, first edge parts and second edge parts that are the edges of chips are melted by executing irradiation with a laser beam. Therefore, the edges of the chips can be planarize. In addition, cracks, chipping, and so forth caused in the edges of the chips can be coupled. Therefore, it becomes possible to repair at least part of processing strain of the edges of the chips. As a result, a flexural strength of the chips can be...