ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,756, issued on June 23, was assigned to DISCO Corp. (Tokyo).

"Method of grinding workpiece including two grinding steps" was invented by Makoto Saito (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A workpiece to be ground by a grinding wheel of a grinding apparatus has a first layer including a first material and a second layer including a second material that is harder to grind than the first material and stacked on the first layer. The rotational speed of the grinding wheel for grinding the second layer, i.e., a second rotational speed, is lower than the rotational speed of the grinding wheel for grinding the first layer, i.e., a first rota...