US Patent Issued to DISCO on June 23 for "Chip treating method" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,923, issued on June 23, was assigned to DISCO Corp. (Tokyo).

"Chip treating method" was invented by Masaru Nakamura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip treating method includes a first tape affixing step of affixing a first tape to a circular wafer, a ring frame unit forming step of removing a central part of the wafer to form a ring frame unit having an opening, and a chip disposing step of disposing chips on the first tape exposed in the opening."

The patent was filed on July 18, 2023, under Application No. 18/354,051.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/net...