US Patent Issued to DISCO on June 16 for "Diamond substrate manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,259, issued on June 16, was assigned to DISCO Corp. (Tokyo).

"Diamond substrate manufacturing method" was invented by Naoki Murazawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A diamond substrate manufacturing method includes positioning a focal point of a processing laser beam of such a wavelength as to be transmitted through diamond to a depth from a first surface of a workpiece including diamond, the depth corresponding to a thickness of a diamond substrate to be manufactured, applying the processing laser beam to form a peeling layer including graphite sections formed through graphitization of portions inside the workpiece and cracks ...