ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,615, issued on July 7, was assigned to DISCO Corp. (Tokyo).
"Method for processing device wafer" was invented by Naoko Yamamoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method for processing a device wafer, in which a device layer, the device layer constituting devices, is stacked on a base material and the devices are formed, respectively, in regions defined by a plurality of intersecting streets on a front surface of the base material. The method includes a first step of dividing the device layer along the streets, a second step of dividing the base material by plasma etching along the streets, and a third step of, befor...