US Patent Issued to DISCO on July 14 for "Wafer processing method and wafer processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,067, issued on July 14, was assigned to DISCO Corp. (Tokyo).

"Wafer processing method and wafer processing system" was invented by Yuki Inoue (Tokyo) and Naoko Yamamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method includes an outer edge removing step of removing an outer edge of a first wafer having a first wiring layer formed on a front surface thereof from the front surface, and a polishing step of polishing the first wiring layer on the front surface of the first wafer after the outer edge removing step."

The patent was filed on May 26, 2023, under Application No. 18/324,262.

*For further information, includin...