ALEXANDRIA, Va., April 7 -- United States Patent no. 12,594,640, issued on April 7, was assigned to DISCO Corp. (Tokyo).
"Grinding method for slice wafer" was invented by Hidekazu Nakayama (Tokyo) and Kazutaka Kuwana (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer grinding method includes a step of forming a protective member on one side of a wafer, a first grinding step of grinding the other side of the wafer by setting a chuck-table rotating shaft and a grinding-stone rotating shaft at a first tilt correlation that has taken into consideration sinking of the wafer by compression of the protective member during grinding, and a second grinding step of grinding the wafer on its one side to a pre...