ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,769, issued on April 21, was assigned to DISCO Corp. (Tokyo).
"Processing method" was invented by Naoko Yamamoto (Tokyo) and Tomoaki Sugiyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate substrate is divided along a plurality of intersecting scheduled division lines. The laminate substrate has a first substrate and a second substrate formed of the same material, laminated through an intermediate layer containing metal. The laminate substrate is divided by cutting the laminate substrate along the scheduled division lines by use of a substrate cutting blade to form the first substrate with first cut grooves each having a width lar...