US Patent Issued to DISCO CORPORATIN on Oct. 20 for "Marking machine and wafer production system" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,639, issued on Oct. 20, was assigned to DISCO CORPORATIN (Tokyo).

"Marking machine and wafer production system" was invented by Kentaro Iizuka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored i...