ALEXANDRIA, Va., May 19 -- United States Patent no. 12,632,953, issued on May 19, was assigned to Diodes Inc. (Plano, Texas), Shanghai Kaihong Technology Co. Ltd. (Shanghai), Diodes Technology (Chengdu) Co. Ltd. (Chengdu, China) and Shanghai Kaihong Electronic Co. Ltd. (Shanghai).
"Semiconductor molding system and foreign object detection method" was invented by Desen Wang (Chengdu, China) and Zhigang Feng (Chengdu, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor molding system is provided that includes a molding device, an image collection device, and a controller connected to the molding device and the image collection device. The image collection device is configured to obtain a targe...