US Patent Issued to DigWise Technology on July 28 for "Device and method for semiconductor chip assistance design and method for constructing chip characteristics model" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,694,176, issued on July 28, was assigned to DigWise Technology Corp. LTD (Hsinchu County, Taiwan).

"Device and method for semiconductor chip assistance design and method for constructing chip characteristics model" was invented by Shih-Hao Chen (Hsinchu County, Taiwan) and Chen-Hsiang Kao (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-assisted design device and a method for constructing a chip characteristic distribution model. The apparatus includes a database and a processor. The database has a first chip characteristic distribution image data generated based on a wafer fabrication process data of a current process, wher...