US Patent Issued to DIC on March 17 for "Pressure-sensitive adhesive tape" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,441, issued on March 17, was assigned to DIC Corp. (Tokyo).

"Pressure-sensitive adhesive tape" was invented by Daisuke Watanabe (Saitama, Japan), Kota Suetsugu (Saitama, Japan), Akira Yamakami (Saitama, Japan) and Yumi Kagiyama (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive tape with high repeelability from the state that a portion of the adhesive tape has already been peeled from an adherend is provided. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 90 MPa and an elongation at break in a range of 400% to 3000%. The adhesive tape satisfies...