US Patent Issued to DIC on June 2 for "Curable resin, curable resin composition, and cured product" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,977, issued on June 2, was assigned to DIC Corp. (Tokyo).

"Curable resin, curable resin composition, and cured product" was invented by Ryuichi Matsuoka (Chiba, Japan), Lichen Yang (Chiba, Japan) and Hiroyoshi Kannari (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structu...