US Patent Issued to DIC on Aug. 4 for "Mold, method for manufacturing plate-shaped molded article, method for manufacturing test piece, and method for predicting characteristics of resin composition molded article" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,760, issued on Aug. 4, was assigned to DIC Corp. (Tokyo).

"Mold, method for manufacturing plate-shaped molded article, method for manufacturing test piece, and method for predicting characteristics of resin composition molded article" was invented by Ryuhei Kurokawa (Chihara, Japan) and Kazuhiro Ichikawa (Ichihara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mold, a method for producing a plate-shaped molded article, and a method for producing a test piece capable of easily producing a test piece in which an orientation direction of a filler is highly aligned are provided. A method for predicting a characteristic of a resin composition mol...