US Patent Issued to DIC on April 21 for "Curable resin, curable resin composition, and cured product" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,655, issued on April 21, was assigned to DIC Corp. (Tokyo).

"Curable resin, curable resin composition, and cured product" was invented by Lichen Yang (Chiba, Japan), Ryuichi Matsuoka (Chiba, Japan) and Hiroyoshi Kannari (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a cured product, for example, that is made with a curable resin composition containing a curable resin having a particular structure, a radical polymerization initiator, and a flame retardant and therefore is superior in flame retardancy, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties). Spec...